AMT Hardware Programs · San Diego, CA
WEARABLE
SENSOR &
CHARGING SYSTEMS

Ruggedized hardware built for real-world athlete environments — from enclosure concept and CAD through 3D printed prototypes, PCB collaboration, validation testing, and production-ready design. A true cross-functional hardware program spanning mechanical, electrical, and systems engineering.

Role
Lead Mechanical Engineer
Company
Athlete Management Technologies
Status
Active — Production
Type
Hardware Design & Fabrication
10–20
Iterations Per Program
~50%
Dev Cycle Time Reduction
~30%
Durability Increase
FDM
+ Resin
Additive Manufacturing
The Challenge
BUILT TO
SURVIVE THE FIELD

Athlete wearables sound simple until you account for what they actually go through — sweat, impact, flexion, temperature swings, and repeated handling by people who aren't being careful with them. The hardware has to work perfectly the first time and every time after that.

My job was to take sensor and electronics hardware and design enclosures and mounting systems that could survive that environment while staying manufacturable, serviceable, and production-scalable.

  • Designed and iterated enclosures across 10–20 hardware revisions per program
  • Balanced DFM, DFA, and field durability simultaneously
  • Integrated thermal and vibration considerations into packaging decisions
  • Executed validation testing and drove design changes based on failure analysis
  • Achieved ~30% improvement in durability over initial designs
Wearable Sensor Enclosure
Hardware Gallery
THE WORK
Wearable System Overview
Full System — Wearable Assembly
Enclosure Detail
Enclosure Detail
Prototype Iterations
Prototype Iterations
Internal Assembly
Internal Assembly
Electronics Integration
Electronics Integration
Finished Unit
Finished Unit
Field Ready
Field Ready
How I Work
THE DEVELOPMENT PROCESS
01
Requirements
Define functional, durability, and manufacturing constraints upfront
02
CAD & Analysis
SolidWorks modeling with structural and thermal analysis before printing
03
Prototype
Same-day FDM and resin prints for rapid fit, form, and function checks
04
Test & Fail
Systematic validation testing — root cause any failure before iterating
05
Production
GD&T drawings, DFM review, supplier documentation for production release
Technical Details
TOOLS & METHODS
Design & Analysis
  • SolidWorks — full parametric CAD modeling and assemblies
  • FEA — structural analysis for impact and vibration loads
  • Thermal Analysis — heat dissipation and packaging design
  • GD&T — toleranced drawings for manufacturing
  • DFM / DFA — design for manufacturability and assembly from day one
Fabrication
  • Bambu Lab — high-speed FDM, multi-material functional prototypes
  • Formlabs — resin SLA for precision and fine-feature parts
  • Mingda — large-format FDM for structural components
  • Materials — PLA, PETG, ABS, ASA, TPU, engineering nylons, resins
  • Post-processing — sanding, priming, heat treatment, hardware inserts
Testing & Validation
  • Drop and impact testing across multiple surfaces and angles
  • Vibration and fatigue cycling
  • Thermal soak and cycle testing
  • Moisture ingress evaluation
  • Root cause failure analysis on every failed unit
Design Objectives
  • Field serviceability — accessible, replaceable components
  • Minimal profile — worn hardware must not impede performance
  • Production scalability — designed for volume from prototype day one
  • Sensor accuracy preservation — packaging cannot degrade signal quality
  • Repeatable assembly — consistent build quality across units
Related Program
MULTI-UNIT
CHARGING SYSTEMS
Charging System Overview Charger Detail Multi-Unit Setup

Running parallel to the wearable program, I designed multi-unit charging infrastructure that supports fleet-scale deployment of the sensor hardware.

Key design focus was thermal performance under sustained charging load — multiple units drawing power simultaneously generates real heat that has to go somewhere. Thermal analysis drove the housing geometry and material choices.

Designed for production from the first iteration — clean geometry, minimal assembly steps, and standardized fasteners throughout.

Thermal Management Power Systems DFM Production Scaling
Team & Collaboration
HARDWARE IS
A TEAM SPORT

Across multiple programs at AMT, I worked directly and closely with the electrical engineer to bring hardware systems to life. This wasn't handoff-based collaboration — it was real-time, back-and-forth problem solving at the intersection of mechanical and electrical design.

Multiple prototype PCBs, custom charger boards, and sensor integration assemblies required tight mechanical-electrical coordination to work. Connector placement, thermal management of electronics, flex routing, and fit within constrained enclosure geometries all demanded both disciplines working together from day one — not at the end when changes become expensive.

I brought the mechanical housing, the manufacturability constraints, and the real-world durability requirements. The EE brought the circuit design. Together we built systems that actually work in the field.

Prototype PCBs
Multiple iterations of custom sensor and charger boards designed alongside and around my enclosure geometry — ensuring fit, thermal clearance, and assembly sequence worked together.
Charging Systems Integration
Custom charger boards required coordinated design for connector placement, thermal performance under load, and mechanical retention — all solved jointly between mechanical and electrical.
Systems Thinking
When mechanical and electrical constraints conflict — and they always do — I'm the engineer who understands both sides well enough to find the right compromise fast.
Sub-Project · In Development
INDOOR TRACKING:
UWB SYSTEM

GPS works outdoors. It doesn't work inside a gym, a training facility, or an arena. The next evolution of the AMT athlete tracking system is an indoor positioning architecture built on Ultra-Wideband (UWB) technology — delivering centimeter-level location accuracy in enclosed environments where GPS is unavailable.

The athlete wearable hardware is the same platform — same form factor, same enclosure design, same sensor integration. What changes is the positioning technology: UWB anchors placed around the facility triangulate the wearable's position in real time, enabling the same performance tracking data but now for indoor sports.

This extends the AMT platform to basketball, volleyball, wrestling, gymnastics, combat sports — any indoor athletic environment where precise location data unlocks coaching and performance insights that don't currently exist.

GPS vs UWB
GPS accuracy: 2–5 meters outdoors, unusable indoors. UWB accuracy: 10–30 centimeters indoors, in real time. For athlete tracking, that's the difference between knowing someone was in the paint and knowing exactly where their foot was when they shot.
~10cm
UWB Accuracy
Real-
Time
Position Update
Status
System architecture defined. UWB hardware integration into existing wearable platform is the active engineering challenge — same enclosure, new RF requirements, new anchor infrastructure design.